1, The top heater can move freely along the X, Y axis in the IR preheating area. It is good for many BGA chips distribution at different positions in the PCB board which need repair. X-shaped infrared laser can do rapid location. After location the electromagnetic lock will lock them, with 6-8 heating and cooling temperature settings, servo drives, joystick control, micrometer adjustment, automatic waste gas extraction system and automatic feeding, feeding system are optional;

2,There are 3 independent heaters. The 1^st and 2^nd hot-air heaters can control multiple groups and segments temperature parameters. The 2^nd heater can move up and down. The 3^rd large area IR heater can preheat the PCB board fully to ensure no deformation to the board. Temperature, time, slope, cooling, alarming all can be displayed on the touch screen.

3,High-precision K-type thermocouple with closed loop control, PID auto-tuning system temperature system, combined with Panasonic PLC and highly sensitive temperature module for the precise temperature control, the temperature error controlled within ± 1 degree; The external 4-5 sensors can detect temperature precisely, analyze and calibrate the real temperature curve accurately;

4,V-groove PCB support, rapid positioning, convenience, accuracy, can fit for all kinds of PCB board;

5,Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of BGA repair.

6,The top heater device and mounting head 2 in 1 design and ball screw drive. Z-axis movements are controlled by Panasonic servo system which can accurately control the site and hotspots; with different size alloy BGA nozzles, 360 degree rotation, easy to install and replace, customized is available;

7, High-definition CCD color optical vision system, splitting, amplification, micro-adjust and auto-focus; With automatic color resolution and brightness adjustment device; it can adjust the definition of the image automatically;

8,Without changing the magnification, the optical lens can be moved manually left and right, back and forth freely. It can observe all aspects of the BGA chip. It displays clearly. The X, Y axis and R angle with micrometer adjust, precise positioning, alignment accuracy is within ± 0.01MM, 15 inch TFT LCD Monitor; High automation, no human operations errors

9, CE certification, with emergency switch and automatic power-off protection device when emergency happens; With protective mesh to prevent components falling or human burns happen;

10, Mounting, welding and dewelding process are intelligent controlled and work automatically; BGA mounting position is controlled accurately; after finishing desoldering and soldering, there is alarming. When temperature goes out of control, the circuit w automatically power off; after finishing desoldering and soldering with a double over-temperature protection, there is alarming. When temperature goes out of control, the circuit automatically power off;

11,It can save multiple groups profiles. You can analyze, set and calibrate the temperature parameters curve on the screen at any time. You can print, save and analyze the curve through the USB port without other external devices (such as computer).

12,powerful cross-flow fan to cool the PCB board automatically after desoldering and soldering, it can prevent the deformation of PCB board to ensure the welding effect;

13,human-machine interface, high-definition touch screen(Taiwan), PLC control, password protection and calibrate function, can show seven temperature curves and save multiple profiles, instant curve analysis function;

14,With Multifunctional and humanized operation interface, there is "set up Interface" and "operation interface" on the touch screen to prevent wrong operations and setting; Temperature parameter has password protection to stop arbitrary changes;

15,This machine is equipped with pressure and optical sensors. to control the pressure in 3-10 grams and optical switches, so that it can automatically recognize the suction chip and mounting height, to ensure not crush BGA chip; It can repair Socket775 and double BGA / CGA / IC and various shielding devices, meet the requirement of lead-free process